Enterprise IT funding this week concentrated on the systems required to run, connect, and secure AI at scale. The largest confirmed rounds backed AI factories, workflow infrastructure, physical AI security, energy-efficient silicon, and the networking layers that keep accelerated computing moving.

Crusoe

Round: Series F, initial closing | Sector: Cloud

Crusoe announced the initial closing of its anticipated $3.9 billion Series F, an oversubscribed round co-led by Atreides Management, Mubadala Capital, and Valor Equity Partners. The AI infrastructure provider plans to use the capital to build AI factories, expand modular data-center capacity, and grow Crusoe Cloud, extending its control from power and facilities into the services enterprise customers consume. The size of the financing underlines how quickly AI capacity is becoming an infrastructure-scale capital commitment.

Temporal

Round: Late-stage funding round | Sector: Cloud

Temporal has raised $550 million in a round led by Lightspeed Venture Partners, with Wellington Management, Goldman Sachs Alternatives’ Growth Equity business, and Tiger Global joining as co-leads. The company’s open-source workflow engine and commercial Temporal Cloud help applications, including AI agents, recover from failure, and the new capital will support global operations and platform research. That puts reliability tooling alongside compute as a core part of the enterprise AI stack.

Exein

Round: Equity funding round | Sector: Cybersecurity

Exein closed a significantly oversubscribed $270 million equity round led by Headline at a $1.7 billion valuation, with participation from Sofina, Goldman Sachs, EIB Group, KfW Capital, and T.Capital, among others. The Rome-based company builds security for connected machines, including robots, vehicles, and industrial systems, and plans to use the funding for product development, acquisitions, and expansion in the United States and Asia Pacific. Its focus extends cybersecurity budgets into the devices that make decisions at the edge.

EUCLYD

Round: Series A | Sector: Semiconductors

Eindhoven-based EUCLYD has raised more than €200 million in a Series A led by Samsung, Somerset Capital Partners, EQT’s Scaleup Europe Fund, and Innovation Industries, with additional backing from EIFO, imec.xpand, BOM, and Quadri. The startup is combining proprietary chips, memory architecture, and data-center systems to improve the energy efficiency of AI infrastructure, with the funding directed toward commercial deployment and technical hiring. The round reflects how much capital is moving toward system design beyond the processor itself.

Cornelis

Round: Funding round | Sector: Networking

Cornelis has raised $205 million in a funding round led by IAG Capital Partners to develop its Active Compute Fabric, a networking architecture intended to reduce the time AI chips spend waiting for data. The company has already begun shipping its product and is building a new generation around an open architecture that can work with different GPUs and accelerators. For enterprise infrastructure teams, the practical question is increasingly how efficiently compute can communicate, not only how much compute is installed.

The Weekly Funding Pulse tracks the most significant IT infrastructure, cloud, semiconductor, networking, and ITSM funding rounds each week. Coverage is curated for enterprise IT professionals and decision-makers.

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